摘要
本文提出了一种电子元件建模与检查的算法。首先通过3CCD彩色相机,红、绿、蓝三色LED结构光源获取PCB图像,图像经预处理凸显出元件的颜色特征;然后通过定位算法来实现元件的精确定位,在此基础上,提取元件的窗口位置,区域形态和逻辑等特征来实现对元件质量的检测;最后通过实验证明本算法的有效性和稳定性。
An AOI algorithm for PCB based on feature extraction is presented in this paper.First acquiring image through 3CCD color camera and LED array hemispherical ring structure light resource of red,green,blue,then image is processed to show the features,at last,we extract chip component solder joint's place features,shape features,logical features to check the components.With the proposed algorithm,as it showed in experiments,it can identify lacking solder,surplus solder,no solder,pseudo joints,wrong component,damaged component,component absent,shift,tomb stone,wrong polarity,etc.and it has very little misjudge ratio.
出处
《机电工程技术》
2008年第6期58-61,共4页
Mechanical & Electrical Engineering Technology
基金
粤港关键领域重点突破招标项目(编号:东莞专项20061682)
广东省
教育部产学研结合资助项目(编号:2006D930304001)
