摘要
铜箔是制造印制板的关键性导电材料,它的性能与其表面处理工艺密切相关。着重介绍了一些常用的电解铜箔表面处理工艺规范和镀层特点,概述了当前铜箔表面处理工艺包括高温耐热表面处理、双面铜箔表面处理、超薄铜箔表面处理、高抗张性铜箔表面处理和高频电路用铜箔表面处理等工艺的研究现状。展望了印制板用铜箔的发展趋势。
Copper foil is the key conducting material to the manufacture of PCB. The performance is closely associated with its surface treatment technics. The technical criterion of surface treatment and coating characteristics of some common electrolytic copper foil were introduced. The research status of current copper foil surface treatment technics including high temperature surface treatment for heat resistance, double sided copper foil surface treatment, ultra-thin copper foil surface treatment, high tensile copper foil surface treatment and copper foil surface treatment used for high frequency circuit were summarized. Development trends of copper foil used for PCB was prospected.
出处
《电镀与涂饰》
CAS
CSCD
2006年第12期10-13,17,共5页
Electroplating & Finishing
关键词
铜箔
印制板
表面处理
工艺
copper foil
printed circuit board
surface treatment
technics
