摘要
用电化学测量、Ｘ射线衍射和Ｘ射线电子能谱等方法研究酸性镀铜液中Ｃｌ－离子的作用机理．结果表明：镀液中Ｃｌ－离子加速Ｃｕ￣（２＋）离子的放电反应并使后者按两个单电子步骤进行；Ｘ射线衍射结果表明铜沉积层呈立方结构Ｃｕ，也包含立方结构ＣｕＣｌ；ＸＰＳ谱观察到两个ＣｕＣｌ特征谱峰，Ｃｕ电沉积层中含有ＣｕＣｌ导致其电化学活性降低．
The Effect of Cl￣- ion the acidic copper plating baths is investigated bymeans of electrochemical techniques, XRD and XPS. The results show that Cl￣-ion in theplating baths accelerate Cu￣(2+) ion reduction and cause the reduction proceededvia two one-electron steps.The XRD results show that the Cu deposits obtained from the acidic copperplating baths containing Cl￣- ion exhibit cubic structure copper and cubic structure CuCl.Thepresence of CuCl is also confirmed by XPS analysis. The contaimination of CuCl leads to de-crease the electrochemical activity of copper deposits due to the passivity of CuCl.
出处
《厦门大学学报（自然科学版）》
CAS
CSCD
北大核心
1994年第5期647-651,共5页
Journal of Xiamen University：Natural Science
基金
国家自然科学基金
关键词
酸性镀铜
镀液
氯离子
铜沉积层
Acidic copper plating,Cl￣- Ion,Electrochemical activity of deposits
